| |
| 2006 | ||
|---|---|---|
| 1 | EE | F. Chen, J. Gill, D. Harmon, T. Sullivan, A. Strong, B. Li, H. Rathore, Daniel C. Edelstein: Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures. Microelectronics Reliability 46(2-4): 232-243 (2006) |
| 1 | F. Chen | [1] |
| 2 | Daniel C. Edelstein | [1] |
| 3 | J. Gill | [1] |
| 4 | D. Harmon | [1] |
| 5 | B. Li | [1] |
| 6 | H. Rathore | [1] |
| 7 | T. Sullivan | [1] |