| 2006 |
|---|
| 5 | EE | H. C. Yeo,
N. Guo,
H. Du,
W. M. Huang,
X. M. Jian:
Characterisation of IC packaging interfaces and loading effects.
Microelectronics Reliability 46(9-11): 1892-1897 (2006) |
| 2003 |
|---|
| 4 | | H. Du,
M. Shi,
J. Zhang,
X. Jiang:
Wideband Waveform Design Based on Reproducing Kernel.
WAA 2003: 405-410 |
| 2002 |
|---|
| 3 | | X. F. Zha,
H. Du:
Web-Based Collaborative Framework and Environment for Designing and Building Robotic Systems.
ICRA 2002: 2196-2201 |
| 2 | EE | X. F. Zha,
H. Du:
A PDES/STEP-based model and system for concurrent integrated design and assembly planning.
Computer-Aided Design 34(14): 1087-1110 (2002) |
| 2001 |
|---|
| 1 | | X. F. Zha,
H. Du:
Mechanical systems and assemblies modeling using knowledge-intensive Petri nets formalisms.
AI EDAM 15(2): 145-171 (2001) |
