2006 | ||
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1 | EE | F. Chen, J. Gill, D. Harmon, T. Sullivan, A. Strong, B. Li, H. Rathore, Daniel C. Edelstein: Determination of the thermal conductivity of composite low-k dielectrics for advanced interconnect structures. Microelectronics Reliability 46(2-4): 232-243 (2006) |
1 | F. Chen | [1] |
2 | Daniel C. Edelstein | [1] |
3 | J. Gill | [1] |
4 | D. Harmon | [1] |
5 | B. Li | [1] |
6 | A. Strong | [1] |
7 | T. Sullivan | [1] |