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| 2006 | ||
|---|---|---|
| 1 | EE | J. R. Lloyd, C. E. Murray, S. Ponoth, S. Cohen, E. Liniger: The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics. Microelectronics Reliability 46(9-11): 1643-1647 (2006) |
| 1 | S. Cohen | [1] |
| 2 | E. Liniger | [1] |
| 3 | J. R. Lloyd | [1] |
| 4 | S. Ponoth | [1] |