Sarangapani Murali
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2006
1
EE
Sarangapani Murali,
Narasimalu Srikanth
,
Charles J. Vath III
: Effect of wire diameter on the thermosonic bond reliability.
Microelectronics Reliability 46
(2-4): 467-475 (2006)
Coauthor
Index
1
Narasimalu Srikanth
[
1
]
2
Charles J. Vath III
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
