N. H. Kao

2006
2	EE	K. M. Chen, D. S. Jiang, N. H. Kao, J. Y. Lai: Effects of underfill materials on the reliability of low-K flip-chip packaging. Microelectronics Reliability 46(1): 155-163 (2006)
1	EE	K. M. Chen, B. C. Wu, K. H. Tang, F. Y. Cheng, N. H. Kao, J. Y. Lai: An investigation into the effects of probing and wire bonding stress on the reliability of BOAC. Microelectronics Reliability 46(2-4): 335-342 (2006)

Coauthor Index

1	K. M. Chen	[1] [2]
2	F. Y. Cheng	[1]
3	D. S. Jiang	[2]
4	J. Y. Lai	[1] [2]
5	K. H. Tang	[1]
6	B. C. Wu	[1]