| |
| 2006 | ||
|---|---|---|
| 1 | EE | Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik: Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. Microelectronics Reliability 46(2-4): 589-599 (2006) |
| 1 | Suk-Jin Ham | [1] |
| 2 | Kyung-Wook Paik | [1] |