| |
| 2006 | ||
|---|---|---|
| 3 | EE | YoungBae Kim, Hiroshi Noguchi, Masazumi Amagai: Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder. Microelectronics Reliability 46(2-4): 459-466 (2006) |
| 2002 | ||
| 2 | EE | Masazumi Amagai: Mechanical reliability in electronic packaging. Microelectronics Reliability 42(4-5): 607-627 (2002) |
| 1 | EE | Masazumi Amagai, Masako Watanabe, Masaki Omiya, Kikuo Kishimoto, Toshikazu Shibuya: Mechanical characterization of Sn-Ag-based lead-free solders. Microelectronics Reliability 42(6): 951-966 (2002) |
| 1 | YoungBae Kim | [3] |
| 2 | Kikuo Kishimoto | [1] |
| 3 | Hiroshi Noguchi | [3] |
| 4 | Masaki Omiya | [1] |
| 5 | Toshikazu Shibuya | [1] |
| 6 | Masako Watanabe | [1] |