De-Shin Liu

List of publications from the DBLP Bibliography Server - FAQ

2006

4 EE Ching-Yang Chen, Yung-Ching Chao, De-Shin Liu, Zhen-Wei Zhuang: Design of a novel chip on glass package solution for CMOS image sensor device. Microelectronics Reliability 46(8): 1326-1334 (2006)

2002

3 EE De-Shin Liu, Chin-Yu Ni: The optimization design of bump interconnections in flip chip packages from the electrical standpoint. Microelectronics Reliability 42(12): 1893-1901 (2002)

2 EE Chin-Yu Ni, De-Shin Liu, Ching-Yang Chen: Procedure for design optimization of a T-cap flip chip package. Microelectronics Reliability 42(12): 1903-1911 (2002)

1 EE De-Shin Liu, Chin-Yu Ni: A thermo-mechanical study on the electrical resistance of aluminum wire conductors. Microelectronics Reliability 42(3): 367-374 (2002)

2006
4	EE	Ching-Yang Chen, Yung-Ching Chao, De-Shin Liu, Zhen-Wei Zhuang: Design of a novel chip on glass package solution for CMOS image sensor device. Microelectronics Reliability 46(8): 1326-1334 (2006)
2002
3	EE	De-Shin Liu, Chin-Yu Ni: The optimization design of bump interconnections in flip chip packages from the electrical standpoint. Microelectronics Reliability 42(12): 1893-1901 (2002)
2	EE	Chin-Yu Ni, De-Shin Liu, Ching-Yang Chen: Procedure for design optimization of a T-cap flip chip package. Microelectronics Reliability 42(12): 1903-1911 (2002)
1	EE	De-Shin Liu, Chin-Yu Ni: A thermo-mechanical study on the electrical resistance of aluminum wire conductors. Microelectronics Reliability 42(3): 367-374 (2002)

Coauthor Index