Jongwoo Park

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2006

1 EE Jongwoo Park, John Osenbach: Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging. Microelectronics Reliability 46(2-4): 503-511 (2006)

2006
1	EE	Jongwoo Park, John Osenbach: Processability and reliability of epoxy adhesive used in microelectronic devices linked to effects of degree of cure and damp heat aging. Microelectronics Reliability 46(2-4): 503-511 (2006)

Coauthor Index

1 John Osenbach [1]