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| 2006 | ||
|---|---|---|
| 1 | EE | Xu Chen, Jun Zhang, Chunlei Jiao, Yanmin Liu: Effects of different bonding parameters on the electrical performance and peeling strengths of ACF interconnection. Microelectronics Reliability 46(5-6): 774-785 (2006) |
| 1 | Xu Chen | [1] |
| 2 | Yanmin Liu | [1] |
| 3 | Jun Zhang | [1] |