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W.-M. Chen

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2006
1EEW.-M. Chen, Paul McCloskey, S. Cian O'Mathuna: Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders. Microelectronics Reliability 46(5-6): 896-904 (2006)

Coauthor Index

1Paul McCloskey [1]
2S. Cian O'Mathuna [1]

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