2006 | ||
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1 | EE | W.-M. Chen, Paul McCloskey, S. Cian O'Mathuna: Isothermal aging effects on the microstructure and solder bump shear strength of eutectic Sn37Pb and Sn3.5Ag solders. Microelectronics Reliability 46(5-6): 896-904 (2006) |
1 | Paul McCloskey | [1] |
2 | S. Cian O'Mathuna | [1] |