2007 |
3 | EE | M. A. J. van Gils,
W. D. van Driel,
G. Q. Zhang,
H. J. L. Bressers,
R. B. R. van Silfhout,
X. J. Fan,
J. H. J. Janssen:
Virtual qualification of moisture induced failures of advanced packages.
Microelectronics Reliability 47(2-3): 273-279 (2007) |
2006 |
2 | EE | C. Yuan,
W. D. van Driel,
R. B. R. van Silfhout,
O. van der Sluis,
R. A. B. Engelen,
L. J. Ernst,
F. van Keulen,
G. Q. Zhang:
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.
Microelectronics Reliability 46(9-11): 1679-1684 (2006) |
2005 |
1 | EE | W. D. van Driel,
M. A. J. van Gils,
R. B. R. van Silfhout,
G. Q. Zhang:
Prediction of Delamination Related IC & Packaging Reliability Problems.
Microelectronics Reliability 45(9-11): 1633-1638 (2005) |