Rong-Fong Din

List of publications from the DBLP Bibliography Server - FAQ

2006

1 EE Cheng-Li Chuang, Jong-Ning Aoh, Rong-Fong Din: Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process. Microelectronics Reliability 46(2-4): 449-458 (2006)

2006
1	EE	Cheng-Li Chuang, Jong-Ning Aoh, Rong-Fong Din: Oxidation of copper pads and its influence on the quality of Au/Cu bonds during thermosonic wire bonding process. Microelectronics Reliability 46(2-4): 449-458 (2006)

Coauthor Index