Seung-Boo Jung

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4EEJa-Myeong Koo, Seung-Boo Jung: Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package CoRR abs/0711.3306: (2007)
3EEJeong-Won Yoon, H.-S. Chun, Ja-Myeong Koo, Seung-Boo Jung: Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications CoRR abs/0711.3323: (2007)
2EEJong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung: Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application. Microelectronics Reliability 46(2-4): 535-542 (2006)
1EEJeong-Won Yoon, Seung-Boo Jung: High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. Microelectronics Reliability 46(5-6): 905-914 (2006)

Coauthor Index

1H.-S. Chun [3]
2Dae-Gon Kim [2]
3Jong-Woong Kim [2]
4Ja-Myeong Koo [3] [4]
5Jeong-Won Yoon [1] [3]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)