| |
| 2007 | ||
|---|---|---|
| 4 | EE | Ja-Myeong Koo, Seung-Boo Jung: Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package CoRR abs/0711.3306: (2007) |
| 3 | EE | Jeong-Won Yoon, H.-S. Chun, Ja-Myeong Koo, Seung-Boo Jung: Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications CoRR abs/0711.3323: (2007) |
| 2006 | ||
| 2 | EE | Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung: Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application. Microelectronics Reliability 46(2-4): 535-542 (2006) |
| 1 | EE | Jeong-Won Yoon, Seung-Boo Jung: High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. Microelectronics Reliability 46(5-6): 905-914 (2006) |
| 1 | H.-S. Chun | [3] |
| 2 | Dae-Gon Kim | [2] |
| 3 | Jong-Woong Kim | [2] |
| 4 | Ja-Myeong Koo | [3] [4] |
| 5 | Jeong-Won Yoon | [1] [3] |