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D. X. Q. Shi

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2006
1EEY. L. Zhang, D. X. Q. Shi, W. Zhou: Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading. Microelectronics Reliability 46(2-4): 409-420 (2006)

Coauthor Index

1Y. L. Zhang [1]
2W. Zhou [1]

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