D. X. Q. Shi
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2006
1
EE
Y. L. Zhang
, D. X. Q. Shi,
W. Zhou
: Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading.
Microelectronics Reliability 46
(2-4): 409-420 (2006)
Coauthor
Index
1
Y. L. Zhang
[
1
]
2
W. Zhou
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)