| |
| 2006 | ||
|---|---|---|
| 1 | EE | Yan Qi, Rex Lam, Hamid R. Ghorbani, Polina Snugovsky, Jan K. Spelt: Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints. Microelectronics Reliability 46(2-4): 574-588 (2006) |
| 1 | Rex Lam | [1] |
| 2 | Yan Qi | [1] |
| 3 | Polina Snugovsky | [1] |
| 4 | Jan K. Spelt | [1] |