| 2006 |
|---|
| 7 | EE | Torsten Linz,
Christine Kallmayer,
Rolf Aschenbrenner,
Herbert Reichl:
Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics.
BSN 2006: 23-26 |
| 6 | EE | T. Braun,
K.-F. Becker,
M. Koch,
V. Bader,
Rolf Aschenbrenner,
Herbert Reichl:
High-temperature reliability of Flip Chip assemblies.
Microelectronics Reliability 46(1): 144-154 (2006) |
| 2005 |
|---|
| 5 | EE | Torsten Linz,
Christine Kallmayer,
Rolf Aschenbrenner,
Herbert Reichl:
Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric.
ISWC 2005: 86-91 |
| 4 | EE | T. Braun,
K.-F. Becker,
M. Koch,
V. Bader,
Rolf Aschenbrenner,
Herbert Reichl:
Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications.
Microelectronics Reliability 45(9-11): 1672-1675 (2005) |
| 2004 |
|---|
| 3 | EE | Barbara Pahl,
Christine Kallmayer,
Rolf Aschenbrenner,
Herbert Reichl:
Long time reliability study of soldered flip chips on flexible substrates.
Microelectronics Reliability 44(2): 309-314 (2004) |
| 2 | EE | Dionysios Manessis,
Rainer Patzelt,
Andreas Ostmann,
Rolf Aschenbrenner,
Herbert Reichl:
Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping.
Microelectronics Reliability 44(5): 797-803 (2004) |
| 2002 |
|---|
| 1 | EE | Joachim Kloeser,
Paradiso Coskina,
Rolf Aschenbrenner,
Herbert Reichl:
Bump formation for flip chip and CSP by solder paste printing.
Microelectronics Reliability 42(3): 391-398 (2002) |
