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| 2006 | ||
|---|---|---|
| 1 | EE | Robin C. J. Wang, C. C. Lee, L. D. Chen, Kenneth Wu, K. S. Chang-Liao: A study of Cu/Low-k stress-induced voiding at via bottom and its microstructure effect. Microelectronics Reliability 46(9-11): 1673-1678 (2006) |
| 1 | K. S. Chang-Liao | [1] |
| 2 | L. D. Chen | [1] |
| 3 | C. C. Lee | [1] |
| 4 | Kenneth Wu | [1] |