| |
| 2006 | ||
|---|---|---|
| 1 | EE | W. D. van Driel, O. van der Sluis, D. G. Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang: Reliability modelling for packages in flexible end-products. Microelectronics Reliability 46(9-11): 1880-1885 (2006) |
| 1 | W. D. van Driel | [1] |
| 2 | O. van der Sluis | [1] |
| 3 | R. L. J. M. Ubachs | [1] |
| 4 | D. G. Yang | [1] |
| 5 | C. Zenz | [1] |
| 6 | G. Q. Zhang | [1] |