Chih-Kai Fang

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2006

1 EE Yi-Ming Jen, Ying-Lung Wu, Chih-Kai Fang: Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages. Microelectronics Reliability 46(2-4): 386-399 (2006)

2006
1	EE	Yi-Ming Jen, Ying-Lung Wu, Chih-Kai Fang: Impact of the number of chips on the reliability of the solder balls for wire-bonded stacked-chip ball grid array packages. Microelectronics Reliability 46(2-4): 386-399 (2006)

Coauthor Index

1 Yi-Ming Jen [1]

2 Ying-Lung Wu [1]