D. S. Jiang
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2006
1
EE
K. M. Chen
, D. S. Jiang,
N. H. Kao
,
J. Y. Lai
: Effects of underfill materials on the reliability of low-K flip-chip packaging.
Microelectronics Reliability 46
(1): 155-163 (2006)
Coauthor
Index
1
K. M. Chen
[
1
]
2
N. H. Kao
[
1
]
3
J. Y. Lai
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
