2006 | ||
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2 | EE | K. S. Chen, C. H. Wang, H. T. Chen: A MAIC approach to TFT-LCD panel quality improvement. Microelectronics Reliability 46(7): 1189-1198 (2006) |
1 | EE | H. T. Chen, C. Q. Wang, M. Y. Li: Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling. Microelectronics Reliability 46(8): 1348-1356 (2006) |
1 | K. S. Chen | [2] |
2 | M. Y. Li | [1] |
3 | C. H. Wang | [2] |
4 | C. Q. Wang | [1] |