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H. T. Chen

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2006
2EEK. S. Chen, C. H. Wang, H. T. Chen: A MAIC approach to TFT-LCD panel quality improvement. Microelectronics Reliability 46(7): 1189-1198 (2006)
1EEH. T. Chen, C. Q. Wang, M. Y. Li: Numerical and experimental analysis of the Sn3.5Ag0.75Cu solder joint reliability under thermal cycling. Microelectronics Reliability 46(8): 1348-1356 (2006)

Coauthor Index

1K. S. Chen [2]
2M. Y. Li [1]
3C. H. Wang [2]
4C. Q. Wang [1]

Colors in the list of coauthors

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)