| |
| 2006 | ||
|---|---|---|
| 1 | EE | M. C. Yew, C. Y. Chou, C. S. Huang, W. K. Yang, K. N. Chiang: The solder on rubber (SOR) interconnection design and its reliability assessment based on shear strength test and finite element analysis. Microelectronics Reliability 46(9-11): 1874-1879 (2006) |
| 1 | K. N. Chiang | [1] |
| 2 | C. Y. Chou | [1] |
| 3 | W. K. Yang | [1] |
| 4 | M. C. Yew | [1] |