Kuo-Hsiung Houng
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2006
1
EE
Kuo-Ming Chen
, Kuo-Hsiung Houng,
Kuo-Ning Chiang
: Thermal resistance analysis and validation of flip chip PBGA packages.
Microelectronics Reliability 46
(2-4): 440-448 (2006)
Coauthor
Index
1
Kuo-Ming Chen
[
1
]
2
Kuo-Ning Chiang
[
1
]
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Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
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