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J. R. Lloyd

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2006
1EEJ. R. Lloyd, C. E. Murray, S. Ponoth, S. Cohen, E. Liniger: The effect of Cu diffusion on the TDDB behavior in a low-k interlevel dielectrics. Microelectronics Reliability 46(9-11): 1643-1647 (2006)

Coauthor Index

1S. Cohen [1]
2E. Liniger [1]
3C. E. Murray [1]
4S. Ponoth [1]

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