| 2006 |
|---|
| 3 | EE | H. S. Nguyen,
Z. H. Gan,
Zhe Chen,
V. Chandrasekar,
K. Prasad,
S. G. Mhaisalkar,
Ning Jiang:
Reliability studies of barrier layers for Cu/PAE low-k interconnects.
Microelectronics Reliability 46(8): 1309-1314 (2006) |
| 2 | EE | M. Y. Yan,
K. N. Tu,
A. V. Vairagar,
S. G. Mhaisalkar,
Ahila Krishnamoorthy:
A direct measurement of electromigration induced drift velocity in Cu dual damascene interconnects.
Microelectronics Reliability 46(8): 1392-1395 (2006) |
| 2004 |
|---|
| 1 | EE | A. V. Vairagar,
S. G. Mhaisalkar,
Ahila Krishnamoorthy:
Electromigration behavior of dual-damascene Cu interconnects--Structure, width, and length dependences.
Microelectronics Reliability 44(5): 747-754 (2004) |
