| 2006 |
|---|
| 3 | EE | C. Yuan,
W. D. van Driel,
R. B. R. van Silfhout,
O. van der Sluis,
R. A. B. Engelen,
L. J. Ernst,
F. van Keulen,
G. Q. Zhang:
Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions.
Microelectronics Reliability 46(9-11): 1679-1684 (2006) |
| 2005 |
|---|
| 2 | EE | C. Yuan:
Visual Tracking for Seamless 3D Interactions in Augmented Reality.
ISVC 2005: 321-328 |
| 2001 |
|---|
| 1 | EE | Warren Grobman,
M. Thompson,
R. Wang,
C. Yuan,
Ruiqi Tian,
E. Demircan:
Reticle Enhancement Technology: Implications and Challenges for Physical Design.
DAC 2001: 73-78 |
