| 2006 |
|---|
| 5 | EE | Heinrich Wolf,
Horst A. Gieser,
Detlef Bonfert,
Markus Hauser:
ESD Susceptibility of Submicron Air Gaps.
Microelectronics Reliability 46(9-11): 1587-1590 (2006) |
| 4 | EE | Detlef Bonfert,
Horst A. Gieser,
Heinrich Wolf,
M. Frank,
A. Konrad,
J. Schulz:
Transient-induced latch-up test setup for wafer-level and package-level.
Microelectronics Reliability 46(9-11): 1629-1633 (2006) |
| 2005 |
|---|
| 3 | EE | Heinrich Wolf,
Horst A. Gieser,
Wolfgang Stadler,
Wolfgang Wilkening:
Capacitively coupled transmission line pulsing cc-TLP--a traceable and reproducible stress method in the CDM-domain.
Microelectronics Reliability 45(2): 279-285 (2005) |
| 2 | EE | S. Bargstädt-Franke,
Wolfgang Stadler,
K. Esmark,
M. Streibl,
K. Domanski,
Horst A. Gieser,
Heinrich Wolf,
W. Bala:
Transient latch-up: experimental analysis and device simulation.
Microelectronics Reliability 45(2): 297-304 (2005) |
| 1 | EE | Heinrich Wolf,
Horst A. Gieser,
Wolfgang Soldner,
Harald Gossner:
A Dedicated TLP Set-Up to Investigate the ESD Robustness of RF Elements and Circuits.
Microelectronics Reliability 45(9-11): 1421-1424 (2005) |
