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W. C. Chiang

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2006
1EEM. Y. Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu: Thermal deformation measurements and predictions of MAP-BGA electronic packages. Microelectronics Reliability 46(2-4): 476-486 (2006)

Coauthor Index

1G. H. Hsu [1]
2T. M. Liu [1]
3M. Y. Tsai [1]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)