H. L. J. Pang

2006
2	EE	Yuqi Wang, K. H. Low, H. L. J. Pang, K. H. Hoon, F. X. Che, Y. S. Yong: Modeling and simulation for a drop-impact analysis of multi-layered printed circuit boards. Microelectronics Reliability 46(2-4): 558-573 (2006)
2004
1	EE	X. Q. Shi, H. L. J. Pang, X. R. Zhang: Investigation of long-term reliability and failure mechanism of solder interconnections with multifunctional micro-moiré interferometry system. Microelectronics Reliability 44(5): 841-852 (2004)

Coauthor Index

1	F. X. Che	[2]
2	K. H. Hoon	[2]
3	K. H. Low	[2]
4	X. Q. Shi	[1]
5	Yuqi Wang	[2]
6	Y. S. Yong	[2]
7	X. R. Zhang	[1]

Colors in the list of coauthors