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| 2006 | ||
|---|---|---|
| 1 | EE | K. M. Chen, B. C. Wu, K. H. Tang, F. Y. Cheng, N. H. Kao, J. Y. Lai: An investigation into the effects of probing and wire bonding stress on the reliability of BOAC. Microelectronics Reliability 46(2-4): 335-342 (2006) |
| 1 | K. M. Chen | [1] |
| 2 | N. H. Kao | [1] |
| 3 | J. Y. Lai | [1] |
| 4 | K. H. Tang | [1] |
| 5 | B. C. Wu | [1] |