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Kellin Ng

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2006
1EEDesmond Y. R. Chong, F. X. Che, John H. L. Pang, Kellin Ng, Jane Y. N. Tan, Patrick T. H. Low: Drop impact reliability testing for lead-free and lead-based soldered IC packages. Microelectronics Reliability 46(7): 1160-1171 (2006)

Coauthor Index

1F. X. Che [1]
2Desmond Y. R. Chong [1]
3Patrick T. H. Low [1]
4John H. L. Pang [1]
5Jane Y. N. Tan [1]

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