| |
| 2006 | ||
|---|---|---|
| 2 | EE | Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik: Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. Microelectronics Reliability 46(2-4): 512-522 (2006) |
| 1 | EE | Woon-Seong Kwon, Suk-Jin Ham, Kyung-Wook Paik: Deformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study. Microelectronics Reliability 46(2-4): 589-599 (2006) |
| 1 | Suk-Jin Ham | [1] |
| 2 | Young-Doo Jeon | [2] |
| 3 | Woon-Seong Kwon | [1] |
| 4 | Soon-Bok Lee | [2] |
| 5 | Se Young Yang | [2] |