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| 2006 | ||
|---|---|---|
| 1 | EE | Sanka Ganesan, Michael G. Pecht, Sharon Ling: Use of high temperature operating life data to mitigate risks in long-duration space applications that deploy commercial-grade plastic encapsulated semiconductor devices. Microelectronics Reliability 46(2-4): 360-366 (2006) |
| 1 | Sanka Ganesan | [1] |
| 2 | Michael G. Pecht | [1] |