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| 2007 | ||
|---|---|---|
| 2 | EE | B. Vermeersch, Gilbert De Mey: Influence of substrate thickness on thermal impedance of microelectronic structures. Microelectronics Reliability 47(2-3): 437-443 (2007) |
| 2006 | ||
| 1 | EE | B. Vermeersch, Gilbert De Mey: Thermal impedance plots of micro-scaled devices. Microelectronics Reliability 46(1): 174-177 (2006) |
| 1 | Gilbert De Mey | [1] [2] |