| |
| 2006 | ||
|---|---|---|
| 1 | EE | Jong-Woong Kim, Dae-Gon Kim, Seung-Boo Jung: Evaluation of displacement rate effect in shear test of Sn-3Ag-0.5Cu solder bump for flip chip application. Microelectronics Reliability 46(2-4): 535-542 (2006) |
| 1 | Seung-Boo Jung | [1] |
| 2 | Dae-Gon Kim | [1] |