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Yiping Wu

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2006
1EEBo Tao, Yiping Wu, Han Ding, You-Lun Xiong: A quantitative method of reliability estimation for surface mount solder joints based on heating factor Qeta. Microelectronics Reliability 46(5-6): 864-872 (2006)

Coauthor Index

1Han Ding [1]
2Bo Tao [1]
3You-Lun Xiong [1]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)