| |
| 2006 | ||
|---|---|---|
| 1 | EE | Bo Tao, Yiping Wu, Han Ding, You-Lun Xiong: A quantitative method of reliability estimation for surface mount solder joints based on heating factor Qeta. Microelectronics Reliability 46(5-6): 864-872 (2006) |
| 1 | Han Ding | [1] |
| 2 | Bo Tao | [1] |
| 3 | You-Lun Xiong | [1] |