X. M. Jian
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2006
1
EE
H. C. Yeo
,
N. Guo
,
H. Du
,
W. M. Huang
, X. M. Jian: Characterisation of IC packaging interfaces and loading effects.
Microelectronics Reliability 46
(9-11): 1892-1897 (2006)
Coauthor
Index
1
H. Du
[
1
]
2
N. Guo
[
1
]
3
W. M. Huang
[
1
]
4
H. C. Yeo
[
1
]
Copyright ©
Sun May 17 03:24:02 2009 by
Michael Ley
(
ley@uni-trier.de
)
