| 2007 |
|---|
| 4 | EE | Yuki Fukuda,
Michael D. Osterman,
Michael G. Pecht:
The impact of electrical current, mechanical bending, and thermal annealing on tin whisker growth.
Microelectronics Reliability 47(1): 88-92 (2007) |
| 2006 |
|---|
| 3 | EE | Tong Fang,
Michael D. Osterman,
Michael G. Pecht:
Statistical analysis of tin whisker growth.
Microelectronics Reliability 46(5-6): 846-849 (2006) |
| 2002 |
|---|
| 2 | EE | Ricky Valentin,
Jeremy Cunningham,
Michael D. Osterman,
Abhijit Dasgupta II,
Michael G. Pecht,
Dinos Tsagos:
Weapon and communication systems: virtual life assessment of electronic hardware used in the Advanced Amphibious Assault Vehicle (AAAV).
Winter Simulation Conference 2002: 948-953 |
| 1990 |
|---|
| 1 | EE | Michael D. Osterman,
Michael G. Pecht:
Placement for reliability and routability of convectively cooled PWBs.
IEEE Trans. on CAD of Integrated Circuits and Systems 9(7): 734-744 (1990) |
