| 2006 |
|---|
| 5 | EE | Rudolf Schlangen,
Peter Sadewater,
Uwe Kerst,
Christian Boit:
Contact to contacts or silicide by use of backside FIB circuit edit allowing to approach every active circuit node.
Microelectronics Reliability 46(9-11): 1498-1503 (2006) |
| 2005 |
|---|
| 4 | EE | Sanjib Kumar Brahma,
Christian Boit,
Arkadiusz Glowacki:
Seebeck Effect Detection on Biased Device without OBIRCH Distortion Using FET Readout.
Microelectronics Reliability 45(9-11): 1487-1492 (2005) |
| 3 | EE | Rudolf Schlangen,
Uwe Kerst,
A. Kabakow,
Christian Boit:
Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations.
Microelectronics Reliability 45(9-11): 1544-1549 (2005) |
| 2001 |
|---|
| 2 | EE | Bernd Ebersberger,
Alexander Olbrich,
Christian Boit:
Scanning probe microscopy in semiconductor failure analysis.
Microelectronics Reliability 41(8): 1231-1236 (2001) |
| 1 | | Bernd Ebersberger,
Alexander Olbrich,
Christian Boit:
Application of Scanning Probe Microscopy techniques in Semiconductor Failure Analysis.
Microelectronics Reliability 41(9-10): 1449-1458 (2001) |
