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Jeong-Won Yoon

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2007
2EEJeong-Won Yoon, H.-S. Chun, Ja-Myeong Koo, Seung-Boo Jung: Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications CoRR abs/0711.3323: (2007)
2006
1EEJeong-Won Yoon, Seung-Boo Jung: High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. Microelectronics Reliability 46(5-6): 905-914 (2006)

Coauthor Index

1H.-S. Chun [2]
2Seung-Boo Jung [1] [2]
3Ja-Myeong Koo [2]

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