| |
| 2007 | ||
|---|---|---|
| 2 | EE | Jeong-Won Yoon, H.-S. Chun, Ja-Myeong Koo, Seung-Boo Jung: Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications CoRR abs/0711.3323: (2007) |
| 2006 | ||
| 1 | EE | Jeong-Won Yoon, Seung-Boo Jung: High temperature reliability and interfacial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging. Microelectronics Reliability 46(5-6): 905-914 (2006) |
| 1 | H.-S. Chun | [2] |
| 2 | Seung-Boo Jung | [1] [2] |
| 3 | Ja-Myeong Koo | [2] |