| |
| 2006 | ||
|---|---|---|
| 1 | EE | Chih-Tang Peng, Chia-Tai Kuo, Kuo-Ning Chiang, Terry Ku, Kenny Chang: Experimental characterization and mechanical behavior analysis of intermetallic compounds of Sn-3.5Ag lead-free solder bump with Ti/Cu/Ni UBM on copper chip. Microelectronics Reliability 46(2-4): 523-534 (2006) |
| 1 | Kenny Chang | [1] |
| 2 | Kuo-Ning Chiang | [1] |
| 3 | Terry Ku | [1] |
| 4 | Chia-Tai Kuo | [1] |