| |
| 2006 | ||
|---|---|---|
| 5 | EE | Chang-Lin Yeh, Yi-Shao Lai: Support excitation scheme for transient analysis of JEDEC board-level drop test. Microelectronics Reliability 46(2-4): 626-636 (2006) |
| 4 | EE | Yi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh: Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectronics Reliability 46(2-4): 645-650 (2006) |
| 3 | EE | Chang-Lin Yeh, Yi-Shao Lai: Transient fracturing of solder joints subjected to displacement-controlled impact loads. Microelectronics Reliability 46(5-6): 885-895 (2006) |
| 2 | EE | Chang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao: Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectronics Reliability 46(7): 1172-1182 (2006) |
| 2005 | ||
| 1 | EE | Chang-Lin Yeh, Yi-Shao Lai: Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. Microelectronics Reliability 45(2): 371-378 (2005) |
| 1 | Chin-Li Kao | [2] |
| 2 | Yi-Shao Lai | [1] [2] [3] [4] [5] |
| 3 | Ping-Feng Yang | [4] |