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Chang-Lin Yeh

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2006
5EEChang-Lin Yeh, Yi-Shao Lai: Support excitation scheme for transient analysis of JEDEC board-level drop test. Microelectronics Reliability 46(2-4): 626-636 (2006)
4EEYi-Shao Lai, Ping-Feng Yang, Chang-Lin Yeh: Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition. Microelectronics Reliability 46(2-4): 645-650 (2006)
3EEChang-Lin Yeh, Yi-Shao Lai: Transient fracturing of solder joints subjected to displacement-controlled impact loads. Microelectronics Reliability 46(5-6): 885-895 (2006)
2EEChang-Lin Yeh, Yi-Shao Lai, Chin-Li Kao: Evaluation of board-level reliability of electronic packages under consecutive drops. Microelectronics Reliability 46(7): 1172-1182 (2006)
2005
1EEChang-Lin Yeh, Yi-Shao Lai: Transient analysis of the impact stage of wirebonding on Cu/low-K wafers. Microelectronics Reliability 45(2): 371-378 (2005)

Coauthor Index

1Chin-Li Kao [2]
2Yi-Shao Lai [1] [2] [3] [4] [5]
3Ping-Feng Yang [4]

Copyright © Sun May 17 03:24:02 2009 by Michael Ley (ley@uni-trier.de)