F. van Keulen

2006
1	EE	C. Yuan, W. D. van Driel, R. B. R. van Silfhout, O. van der Sluis, R. A. B. Engelen, L. J. Ernst, F. van Keulen, G. Q. Zhang: Delamination analysis of Cu/low-k technology subjected to chemical-mechanical polishing process conditions. Microelectronics Reliability 46(9-11): 1679-1684 (2006)

Coauthor Index

1	W. D. van Driel	[1]
2	R. A. B. Engelen	[1]
3	L. J. Ernst	[1]
4	R. B. R. van Silfhout	[1]
5	O. van der Sluis	[1]
6	C. Yuan	[1]
7	G. Q. Zhang	[1]