Hyo S. Lee

List of publications from the DBLP Bibliography Server - FAQ

2006

1 EE Dong-Jun Lee, Hyo S. Lee: Major factors to the solder joint strength of ENIG layer in FC BGA package. Microelectronics Reliability 46(7): 1119-1127 (2006)

2006
1	EE	Dong-Jun Lee, Hyo S. Lee: Major factors to the solder joint strength of ENIG layer in FC BGA package. Microelectronics Reliability 46(7): 1119-1127 (2006)

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