| |
| 2006 | ||
|---|---|---|
| 2 | EE | C. T. Pan, P. J. Cheng, C. K. Yen, C. C. Hsieh: Application of polyimide to bending-mode microactuators with Ni/Fe and Fe/Pt magnet. Microelectronics Reliability 46(8): 1369-1381 (2006) |
| 2005 | ||
| 1 | EE | C. T. Pan, P. J. Cheng, M. F. Chen, C. K. Yen: Intermediate wafer level bonding and interface behavior. Microelectronics Reliability 45(3-4): 657-663 (2005) |
| 1 | M. F. Chen | [1] |
| 2 | P. J. Cheng | [1] [2] |
| 3 | C. C. Hsieh | [2] |
| 4 | C. K. Yen | [1] [2] |