| |
| 2006 | ||
|---|---|---|
| 2 | EE | Mohd Khairuddin Md Arshad, Ibrahim Ahmad, Azman Jalar, Ghazali Omar: The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition. Microelectronics Reliability 46(2-4): 367-379 (2006) |
| 1 | EE | Hoh Huey Jiun, Ibrahim Ahmad, Azman Jalar, Ghazali Omar: Effect of wafer thinning methods towards fracture strength and topography of silicon die. Microelectronics Reliability 46(5-6): 836-845 (2006) |
| 1 | Ibrahim Ahmad | [1] [2] |
| 2 | Mohd Khairuddin Md Arshad | [2] |
| 3 | Hoh Huey Jiun | [1] |
| 4 | Ghazali Omar | [1] [2] |