Volume 42,
Number 1,
January 2002
- Koen G. Verhaege, Markus P. J. Mergens, Christian C. Russ, John Armer, Phillip Jozwiak:
Novel design of driver and ESD transistors with significantly reduced silicon area.
3-13
Electronic Edition (link) BibTeX
- Yoshihiro Takao, Hiroshi Kudo, Junichi Mitani, Yoshiyuki Kotani, Satoshi Yamaguchi, Keizaburo Yoshie, Kazuo Sukegawa, Nobuhisa Naori, Satoru Asai, Michiari Kawano:
A 0.11 mum CMOS technology featuring copper and very low k interconnects with high performance and reliability.
15-25
Electronic Edition (link) BibTeX
- Jie-Hua Zhao, Wen-Jie Qi, Paul S. Ho:
Thermomechanical property of diffusion barrier layer and its effect on the stress characteristics of copper submicron interconnect structures.
27-34
Electronic Edition (link) BibTeX
- Douglas Brisbin, Prasad Chaparala:
Influence of test techniques on soft breakdown detection in ultra-thin oxides.
35-39
Electronic Edition (link) BibTeX
- M. Fadlallah, G. Ghibaudo, J. Jomaah, M. Zoaeter, G. Guégan:
Static and low frequency noise characterization of surface- and buried-mode 0.1 mum P and N MOSFETs.
41-46
Electronic Edition (link) BibTeX
- Tetsuya Suemitsu, Yoshino K. Fukai, Hiroki Sugiyama, Kazuo Watanabe, Haruki Yokoyama:
Bias-stress-induced increase in parasitic resistance of InP-based InAlAs/InGaAs HEMTs.
47-52
Electronic Edition (link) BibTeX
- Giovanna Sozzi, Roberto Menozzi:
High-electric-field effects and degradation of AlGaAs/GaAs power HFETs: a numerical study.
53-59
Electronic Edition (link) BibTeX
- J. Roig, D. Flores, M. Vellvehí, J. Rebollo, J. Millán:
Reduction of self-heating effect on SOIM devices.
61-66
Electronic Edition (link) BibTeX
- Rodolfo Quintero, Antonio Cerdeira, Adelmo Ortiz-Conde:
Quasi-three-dimensional spice-based simulation of the transient behavior, including plasma spread, of thyristors and over-voltage protectors.
67-76
Electronic Edition (link) BibTeX
- Kinuko Mishiro, Shigeo Ishikawa, Mitsunori Abe, Toshio Kumai, Yutaka Higashiguchi, Ken-ichiro Tsubone:
Effect of the drop impact on BGA/CSP package reliability.
77-82
Electronic Edition (link) BibTeX
- Yu-Jung Huang, Mei-hui Guo, Shen-Li Fu:
Reliability and routability consideration for MCM placement.
83-91
Electronic Edition (link) BibTeX
- Chia-Pin Chiu, James Maveety, Quan A. Tran:
Characterization of solder interfaces using laser flash metrology.
93-100
Electronic Edition (link) BibTeX
- Tsorng-Dih Yuan, Bor Zen Hong, Howard-H. Chen, Li-Kong Wang:
Integrated electro-thermomechanical analysis of nonuniformly chip-powered microelectronic system.
101-108
Electronic Edition (link) BibTeX
- N. Y. A. Shammas, M. P. Rodriguez, F. Masana:
A simple method for evaluating the transient thermal response of semiconductor devices.
109-117
Electronic Edition (link) BibTeX
- Christine Naito, Michael Todd:
The effects of curing parameters on the properties development of an epoxy encapsulant material.
119-125
Electronic Edition (link) BibTeX
- C.-H. Chiao, W. Y. Wang:
Reliability improvement of fluorescent lamp using grey forecasting model.
127-134
Electronic Edition (link) BibTeX
- Seok Hwan Moon, Gunn Hwang, Ho Gyeong Yun, Tae Goo Choy, Young I. I. Kang:
Improving thermal performance of miniature heat pipe for notebook PC cooling.
135-140
Electronic Edition (link) BibTeX
- S. Paul, F. J. Clough:
A reliability of different metal contacts with amorphous carbon.
141-143
Electronic Edition (link) BibTeX
- Jin He, Xing Zhang, Ru Huang, Yangyuan Wang:
Application of forward gated-diode R-G current method in extracting F-N stress-induced interface traps in SOI NMOSFETs.
145-148
Electronic Edition (link) BibTeX
- F. S. Lomeli, Antonio Cerdeira:
Precise SPICE macromodel applied to high-voltage power MOSFET.
149-152
Electronic Edition (link) BibTeX
- Hu Guijun, Shi Jiawei, Zhang Shumei, Zhang Fenggang:
The correlation between the low-frequency electrical noise of high-power quantum well lasers and devices surface non-radiative current.
153-156
Electronic Edition (link) BibTeX
Volume 42,
Number 2,
February 2002
- E. Atanassova, A. Paskaleva:
Breakdown fields and conduction mechanisms in thin Ta2O5 layers on Si for high density DRAMs.
157-173
Electronic Edition (link) BibTeX
- Lingfeng Mao, Heqiu Zhang, Changhua Tan, Mingzhen Xu:
The effect of transition region on the direct tunneling current and Fowler-Nordheim tunneling current oscillations in ultrathin MOS structures.
175-181
Electronic Edition (link) BibTeX
- Lei Du, Yiqi Zhuang, Yong Wu:
1/fgamma Noise separated from white noise with wavelet denoising.
183-188
Electronic Edition (link) BibTeX
- Nobuyuki Sano, Kazuya Matsuzawa, Mikio Mukai, Noriaki Nakayama:
On discrete random dopant modeling in drift-diffusion simulations: physical meaning of 'atomistic' dopants.
189-199
Electronic Edition (link) BibTeX
- Shinya Ito, Hiroaki Namba, Tsuyoshi Hirata, Koichi Ando, Shin Koyama, Nobuyuki Ikezawa, Tatsuya Suzuki, Takehiro Saitoh, Tadahiko Horiuchi:
Effect of mechanical stress induced by etch-stop nitride: impact on deep-submicron transistor performance.
201-209
Electronic Edition (link) BibTeX
- Young S. Chung, Bob Baird:
Power capability limits of power MOSFET devices.
211-218
Electronic Edition (link) BibTeX
- Takeshi Yanagisawa, Takeshi Kojima, Tadamasa Koyanagi, Kiyoshi Takahisa, Kuniomi Nakamura:
Changes in the characteristics of CuInGaSe2 solar cells under light irradiation and during recovery: degradation analysis by the feeble light measuring method.
219-223
Electronic Edition (link) BibTeX
- O. Jeandupeux, V. Marsico, A. Acovic, P. Fazan, H. Brune, K. Kern:
Use of scanning capacitance microscopy for controlling wafer processing.
225-231
Electronic Edition (link) BibTeX
- Philip M. Fabis:
The processing technology and electronic packaging of CVD diamond: a case study for GaAs/CVD diamond plastic packages.
233-252
Electronic Edition (link) BibTeX
- K. Jonnalagadda:
Reliability of via-in-pad structures in mechanical cycling fatigue.
253-258
Electronic Edition (link) BibTeX
- M. S. Kilijanski, Y.-L. Shen:
Analysis of thermal stresses in metal interconnects with multilevel structures.
259-264
Electronic Edition (link) BibTeX
- Andrew J. G. Strandjord, Scott Popelar, Christine Jauernig:
Interconnecting to aluminum- and copper-based semiconductors (electroless-nickel/gold for solder bumping and wire bonding).
265-283
Electronic Edition (link) BibTeX
- Yu-Lung Lo, Chih-Chiang Tsao:
Wirebond profiles characterized by a modified linkage-spring model which includes a looping speed factor.
285-291
Electronic Edition (link) BibTeX
- Jinlin Wang:
Underfill of flip chip on organic substrate: viscosity, surface tension, and contact angle.
293-299
Electronic Edition (link) BibTeX
- Rajendra D. Pendse, Peng Zhou:
Methodology for predicting solder joint reliability in semiconductor packages.
301-305
Electronic Edition (link) BibTeX
Volume 42,
Number 3,
March 2002
- Guenther Benstetter, Michael W. Ruprecht, Douglas B. Hunt:
A review of ULSI failure analysis techniques for DRAMs 1. Defect localization and verification.
307-316
Electronic Edition (link) BibTeX
- Hei Wong:
Recent developments in silicon optoelectronic devices.
317-326
Electronic Edition (link) BibTeX
- Domenico Caputo, Fernanda Irrera:
Investigation and modeling of stressed thermal oxides.
327-333
Electronic Edition (link) BibTeX
- Fen Chen, Rolf-Peter Vollertsen, Baozhen Li, Dave Harmon, Wing L. Lai:
A new empirical extrapolation method for time-dependent dielectric breakdown reliability projections of thin SiO2 and nitride-oxide dielectrics.
335-341
Electronic Edition (link) BibTeX
- Juin J. Liou, R. Shireen, Adelmo Ortiz-Conde, F. J. García Sánchez, Antonio Cerdeira, Xiaofang Gao, Xuecheng Zou, C. S. Ho:
Influence of polysilicon-gate depletion on the subthreshold behavior of submicron MOSFETs.
343-347
Electronic Edition (link) BibTeX
- Yongseok Ahn, Sanghyun Lee, Gwanhyeob Koh, Taeyoung Chung, Kinam Kim:
The abnormality in gate oxide failure induced by stress-enhanced diffusion of polycrystalline silicon.
349-354
Electronic Edition (link) BibTeX
- Yiqi Zhuang, Lei Du:
1/f noise as a reliability indicator for subsurface Zener diodes.
355-360
Electronic Edition (link) BibTeX
- A. Caddemi, N. Donato:
Temperature-dependent noise characterization and modeling of on-wafer microwave transistors.
361-366
Electronic Edition (link) BibTeX
- De-Shin Liu, Chin-Yu Ni:
A thermo-mechanical study on the electrical resistance of aluminum wire conductors.
367-374
Electronic Edition (link) BibTeX
- T. Y. Lin, W. S. Leong, K. H. Chua, R. Oh, Y. Miao, J. S. Pan, J. W. Chai:
The impact of copper contamination on the quality of the second wire bonding process using X-ray photoelectron spectroscopy method.
375-380
Electronic Edition (link) BibTeX
- C. F. Luk, Y. C. Chan, K. C. Hung:
Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies.
381-389
Electronic Edition (link) BibTeX
- Joachim Kloeser, Paradiso Coskina, Rolf Aschenbrenner, Herbert Reichl:
Bump formation for flip chip and CSP by solder paste printing.
391-398
Electronic Edition (link) BibTeX
- T. Alander, S. Nurmi, P. Heino, Eero Ristolainen:
Impact of component placement in solder joint reliability.
399-406
Electronic Edition (link) BibTeX
- J. D. Wu, S. H. Ho, C. Y. Huang, C. C. Liao, P. J. Zheng, S. C. Hung:
Board level reliability of a stacked CSP subjected to cyclic bending.
407-416
Electronic Edition (link) BibTeX
- Didier Cottet, Michael Scheffler, Gerhard Tröster:
A novel, zone based process monitoring method for low cost MCM-D substrates manufactured on large area panels.
417-426
Electronic Edition (link) BibTeX
- P. Grybos, W. Dabrowski, P. Hottowy, R. Szczygiel, K. Swientek, P. Wiacek:
Multichannel mixed-mode IC for digital readout of silicon strip detectors.
427-436
Electronic Edition (link) BibTeX
- Asad A. Ismaeel, R. Bhatnagar, Rajan Mathew:
On-line testable data path synthesis for minimizing testing time.
437-453
Electronic Edition (link) BibTeX
- S. Chakraborty, P. T. Lai, Paul C. K. Kwok:
MOS characteristics of NO-grown oxynitrides on n-type 6H-SiC.
455-458
Electronic Edition (link) BibTeX
- F. Saigné, Olivier Quittard, Laurent Dusseau, F. Joffre, C. Oudéa, J. Fesquet, Jean Gasiot:
Prediction of long-term thermal behavior of an irradiated SRAM based on isochronal annealing measurements.
459-461
Electronic Edition (link) BibTeX
Volume 42,
Numbers 4-5,
April - May 2002
- Ninoslav Stojadinovic, Michael G. Pecht:
Editorial.
463
Electronic Edition (link) BibTeX
- Hiroshi Iwai, Shun'ichiro Ohmi:
Silicon integrated circuit technology from past to future.
465-491
Electronic Edition (link) BibTeX
- Eiji Takeda, Eiichi Murakami, Kazuyoshi Torii, Yutaka Okuyama, Eishi Ebe, Kenji Hinode, Shin'ichiro Kimura:
Reliability issues of silicon LSIs facing 100-nm technology node.
493-506
Electronic Edition (link) BibTeX
- Gilbert De Mey:
A thermodynamic limit for digital electronics.
507-510
Electronic Edition (link) BibTeX
- S. Nakajima, S. Nakamura, K. Kuji, T. Ueki, T. Ajioka, T. Sakai:
Construction of a cost-effective failure analysis service network--microelectronic failure analysis service in Japan.
511-521
Electronic Edition (link) BibTeX
- D. M. Fleetwood:
Effects of hydrogen transport and reactions on microelectronics radiation response and reliability.
523-541
Electronic Edition (link) BibTeX
- Kinam Kim, Gi-Tae Jeong, Chan-Woong Chun, Sam-Jin Hwang:
DRAM reliability.
543-553
Electronic Edition (link) BibTeX
- Ben Kaczer, Robin Degraeve, M. Rasras, A. De Keersgieter, K. Van de Mieroop, Guido Groeseneken:
Analysis and modeling of a digital CMOS circuit operation and reliability after gate oxide breakdown: a case study.
555-564
Electronic Edition (link) BibTeX
- M. K. Radhakrishnan, K. L. Pey, C. H. Tung, W. H. Lin:
Physical analysis of hard and soft breakdown failures in ultrathin gate oxides.
565-571
Electronic Edition (link) BibTeX
- G. Ghibaudo, T. Boutchacha:
Electrical noise and RTS fluctuations in advanced CMOS devices.
573-582
Electronic Edition (link) BibTeX
- Adelmo Ortiz-Conde, F. J. García Sánchez, Juin J. Liou, Antonio Cerdeira, Magali Estrada, Y. Yue:
A review of recent MOSFET threshold voltage extraction methods.
583-596
Electronic Edition (link) BibTeX
- Hei Wong, V. A. Gritsenko:
Defects in silicon oxynitride gate dielectric films.
597-605
Electronic Edition (link) BibTeX
- Masazumi Amagai:
Mechanical reliability in electronic packaging.
607-627
Electronic Edition (link) BibTeX
- Vladimir Székely:
Enhancing reliability with thermal transient testing.
629-640
Electronic Edition (link) BibTeX
- Dawn A. Thomas, Ken Ayers, Michael G. Pecht:
The "trouble not identified" phenomenon in automotive electronics.
641-651
Electronic Edition (link) BibTeX
- Mauro Ciappa:
Selected failure mechanisms of modern power modules.
653-667
Electronic Edition (link) BibTeX
- Ninoslav Stojadinovic, I. Manic, S. Djoric-Veljkovic, V. Davidovic, S. Golubovic, S. Dimitrijev:
Effects of high electric field and elevated-temperature bias stressing on radiation response in power VDMOSFETs.
669-677
Electronic Edition (link) BibTeX
- Mitsuo Fukuda:
Optical semiconductor device reliability.
679-683
Electronic Edition (link) BibTeX
- Gaudenzio Meneghesso, Enrico Zanoni:
Failure modes and mechanisms of InP-based and metamorphic high electron mobility transistors.
685-708
Electronic Edition (link) BibTeX
- Andrzej Dziedzic:
Electrical and structural investigations in reliability characterisation of modern passives and passive integrated components.
709-719
Electronic Edition (link) BibTeX
- Chun-Yen Chang, Jiong-Guang Su, Shyh-Chyi Wong, Tiao-Yuan Huang, Yuan-Chen Sun:
RF CMOS technology for MMIC.
721-733
Electronic Edition (link) BibTeX
- Arokia Nathan, Byung-kyu Park, Qinghua Ma, Andrei Sazonov, John A. Rowlands:
Amorphous silicon technology for large area digital X-ray and optical imaging.
735-746
Electronic Edition (link) BibTeX
- N. Tosic Golo, Fred G. Kuper, Ton J. Mouthaan:
Zapping thin film transistors.
747-765
Electronic Edition (link) BibTeX
- C. F. Luk, Y. C. Chan, K. C. Hung:
Application of adhesive bonding techniques in hard disk drive head assembly.
767-777
Electronic Edition (link) BibTeX
- B. K. Jones:
Logarithmic distributions in reliability analysis.
779-786
Electronic Edition (link) BibTeX
- Juin J. Liou, Qiang Zhang, John McMacken, J. Ross Thomson, Kevin Stiles, Paul Layman:
Statistical modeling of MOS devices for parametric yield prediction.
787-795
Electronic Edition (link) BibTeX
- V. S. Pershenkov, S. V. Avdeev, A. S. Tsimbalov, M. N. Levin, V. V. Belyakov, D. V. Ivashin, A. Y. Slesarev, A. Y. Bashin, G. I. Zebrev, V. N. Ulimov:
Use of preliminary ultraviolet and infrared illumination for diagnostics of MOS and bipolar devices radiation response.
797-804
Electronic Edition (link) BibTeX
Volume 42,
Number 6,
June 2002
- Wolfgang Wondrak:
Special Section on Reliability of Passive Components.
805
Electronic Edition (link) BibTeX
- Reiner W. Kuehl:
Reliability of thin-film resistors: impact of third harmonic screenings.
807-813
Electronic Edition (link) BibTeX
- Jonathan L. Paulsen, Erik K. Reed:
Highly accelerated lifetesting of base-metal-electrode ceramic chip capacitors.
815-820
Electronic Edition (link) BibTeX
- Erik K. Reed, Jonathan L. Paulsen:
Impact of circuit resistance on the breakdown voltage of tantalum chip capacitors.
821-827
Electronic Edition (link) BibTeX
- Jocelyn Siplon, Gary J. Ewell, Thomas Gibson:
ESR concerns in tantalum chip capacitors exposed to non-oxygen-containing environments.
829-834
Electronic Edition (link) BibTeX
- A. Dehbi, W. Wondrak, Y. Ousten, Y. Danto:
High temperature reliability testing of aluminum and tantalum electrolytic capacitors.
835-840
Electronic Edition (link) BibTeX
- Jan Pavelka, Josef Sikula, Petr Vasina, Vlasta Sedlakova, Munecazu Tacano, Sumihisa Hashiguchi:
Noise and transport characterisation of tantalum capacitors.
841-847
Electronic Edition (link) BibTeX
- Petr Vasina, T. Zednicek, Josef Sikula, Jan Pavelka:
Failure modes of tantalum capacitors made by different technologies.
849-854
Electronic Edition (link) BibTeX
- Gregory L. Amorese:
Minimizing equivalent series resistance measurement errors.
855-860
Electronic Edition (link) BibTeX
- Markus P. J. Mergens:
On-Chip ESD.
861
Electronic Edition (link) BibTeX
- Ming-Dou Ker, Chyh-Yih Chang:
ESD protection design for CMOS RF integrated circuits using polysilicon diodes.
863-872
Electronic Edition (link) BibTeX
- Cynthia A. Torres, James W. Miller, Michael Stockinger, Matthew D. Akers, Michael G. Khazhinsky, James C. Weldon:
Modular, portable, and easily simulated ESD protection networks for advanced CMOS technologies.
873-885
Electronic Edition (link) BibTeX
- Craig Salling, Jerry Hu, Jeff Wu, Charvaka Duvvury, Roger Cline, Rith Pok:
Development of substrate-pumped nMOS protection for a 0.13 mum technology.
887-899
Electronic Edition (link) BibTeX
- Bart Keppens, V. De Heyn, M. Natarajan Iyer, Vesselin K. Vassilev, Guido Groeseneken:
Significance of the failure criterion on transmission line pulse testing.
901-907
Electronic Edition (link) BibTeX
- Jon Barth, John Richner:
Correlation considerations: Real HBM to TLP and HBM testers.
909-917
Electronic Edition (link) BibTeX
- Leo G. Henry, Jon Barth, Hugh Hyatt, Tom Diep, Michael Stevens:
Charged device model metrology: limitations and problems.
919-927
Electronic Edition (link) BibTeX
- P. G. Han, Hei Wong, Andy H. P. Chan, M. C. Poon:
A novel approach for fabricating light-emitting porous polysilicon films.
929-933
Electronic Edition (link) BibTeX
- E. Miranda, G. Redin, A. Faigón:
Modeling of the I-V characteristics of high-field stressed MOS structures using a Fowler-Nordheim-type tunneling expression.
935-941
Electronic Edition (link) BibTeX
- Thomas D. Moore, John L. Jarvis:
The effects of in-plane orthotropic properties in a multi-chip ball grid array assembly.
943-949
Electronic Edition (link) BibTeX
- Masazumi Amagai, Masako Watanabe, Masaki Omiya, Kikuo Kishimoto, Toshikazu Shibuya:
Mechanical characterization of Sn-Ag-based lead-free solders.
951-966
Electronic Edition (link) BibTeX
- Afaq Ahmad:
Investigation of a constant behavior of aliasing errors in signature analysis due to the use of different ordered test-patterns in LFSR based testing techniques.
967-974
Electronic Edition (link) BibTeX
- Tomasz Garbolino, Andrzej Hlawiczka:
Efficient test pattern generators based on specific cellular automata structures.
975-983
Electronic Edition (link) BibTeX
- Fuchen Mu, Mingzhen Xu, Changhua Tan, Xiaorong Duan:
Weibull characteristics of n-MOSFET's with ultrathin gate oxides under FN stress and lifetime prediction.
985-989
Electronic Edition (link) BibTeX
- Lingfeng Mao, Changhua Tan, Mingzhen Xu:
Erratum to "The effect of image potential on electron transmission and electric current in the direct tunneling regime of ultra-thin MOS structures" [Microelectronics Reliability 2001;41: 927-931].
991
Electronic Edition (link) BibTeX
- Ninoslav Stojadinovic:
Dependability of Engineering Systems: J.M. Nahman, Springer-Verlag, Berlin, Heidelberg, New York, 2002, 192 pages.
993
Electronic Edition (link) BibTeX
Volume 42,
Number 7,
July 2002
- Wallace T. Anderson, Roberto Menozzi:
Editorial.
995
Electronic Edition (link) BibTeX
- P. F. Marsh, C. S. Whelan, W. E. Hoke, R. E. Leoni III, T. E. Kazior:
Reliability of metamorphic HEMTs on GaAs substrates.
997-1002
Electronic Edition (link) BibTeX
- Frank Gao, Ravi Chanana, Tom Nicholls:
The effects of buffer thickness on GaAs MESFET characteristics: channel-substrate current, drain breakdown, and reliability.
1003-1010
Electronic Edition (link) BibTeX
- Tim Henderson:
Modeling gallium arsenide heterojunction bipolar transistor ledge variations for insight into device reliability.
1011-1020
Electronic Edition (link) BibTeX
- K. Ikossi, W. S. Rabinovich, D. S. Katzer, S. C. Binari, J. Mittereder, P. G. Goetz:
Multiple quantum well PIN optoelectronic devices and a method of restoring failed device characteristics.
1021-1028
Electronic Edition (link) BibTeX
- William J. Roesch:
Methods of reducing defects in GaAs ICs.
1029-1036
Electronic Edition (link) BibTeX
- Hongxia Liu, Yue Hao, Jiangang Zhu:
A thorough investigation of hot-carrier-induced gate oxide breakdown in partially depleted N- and P-channel SIMOX MOSFETs.
1037-1044
Electronic Edition (link) BibTeX
- P. M. Igic, P. A. Mawby, M. S. Towers, W. Jamal, S. G. J. Batcup:
Investigation of the power dissipation during IGBT turn-off using a new physics-based IGBT compact model.
1045-1052
Electronic Edition (link) BibTeX
- O. Perat, J. M. Dorkel, E. Scheid, Pierre Temple-Boyer, Y. S. Chung, A. Peyre-Lavigne, M. Zecri, P. Tounsi:
Characterization method of thermomechanical parameters for microelectronic materials.
1053-1058
Electronic Edition (link) BibTeX
- Marcin Janicki, Gilbert De Mey, Andrzej Napieralski:
Transient thermal analysis of multilayered structures using Green's functions.
1059-1064
Electronic Edition (link) BibTeX
- M. O. Alam, Y. C. Chan, K. C. Hung:
Reliability study of the electroless Ni-P layer against solder alloy.
1065-1073
Electronic Edition (link) BibTeX
- Paavo Jalonen, Aulis Tuominen:
The effect of sputtered interface metallic layers on reinforced core laminate making build-up structures.
1075-1079
Electronic Edition (link) BibTeX
- S. H. Fan, Y. C. Chan:
Effect of misalignment on electrical characteristics of ACF joints for flip chip on flex applications.
1081-1090
Electronic Edition (link) BibTeX
- F. Barlow, A. Lostetter, A. Elshabini:
Low cost flex substrates for miniaturized electronic assemblies.
1091-1099
Electronic Edition (link) BibTeX
- Octavio A. Leon, Gilbert De Mey, Erik Dick:
Study of the optimal layout of cooling fins in forced convection cooling.
1101-1111
Electronic Edition (link) BibTeX
- B. Trégon, Y. Ousten, Y. Danto, L. Béchou, B. Parmentier:
Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions.
1113-1120
Electronic Edition (link) BibTeX
- W. L. Pearn, C. H. Ko, K. H. Wang:
A multiprocess performance analysis chart based on the incapability index Cpp: an application to the chip resistors.
1121-1125
Electronic Edition (link) BibTeX
- K. I. Arshak, D. P. Egan, K. Phelan:
Using statistical design of experiment to investigate the effect of firing parameters on the electrical and magnetic properties of Mn-Zn ferrite.
1127-1132
Electronic Edition (link) BibTeX
- A. T. Kollias, John N. Avaritsiotis:
Analysis and design of thin film resonator ladder filters.
1133-1140
Electronic Edition (link) BibTeX
- T. Cibáková, María Fischerová, Elena Gramatová, Wieslaw Kuzmicz, Witold A. Pleskacz, Jaan Raik, Raimund Ubar:
Hierarchical test generation for combinational circuits with real defects coverage.
1141-1149
Electronic Edition (link) BibTeX
- Mile K. Stojcev:
The Computer Engineering Handbook; Vojin Oklobdzija. CRC Press, Boca Raton, 2002. Hardcover, pp 1338, ISBN 0-8493-0885-2.
1151
Electronic Edition (link) BibTeX
Volume 42,
Number 8,
August 2002
- Marise Bafleur:
In the memory of Georges Charitat.
1153-1154
Electronic Edition (link) BibTeX
- B. Foucher, J. Boullié, B. Meslet, D. Das:
A review of reliability prediction methods for electronic devices.
1155-1162
Electronic Edition (link) BibTeX
- Leon Lantz, Seongdeok Hwang, Michael G. Pecht:
Characterization of plastic encapsulant materials as a baseline for quality assessment and reliability testing.
1163-1170
Electronic Edition (link) BibTeX
- E. Atanassova, Dejan Spasov:
Thermal Ta2O5--alternative to SiO2 for storage capacitor application.
1171-1177
Electronic Edition (link) BibTeX
- W. K. Fong, C. F. Zhu, B. H. Leung, C. Surya, B. Sundaravel, E. Z. Luo, J. B. Xu, I. H. Wilson:
Characterizations of GaN films grown with indium surfactant by RF-plasma assisted molecular beam epitaxy.
1179-1184
Electronic Edition (link) BibTeX
- Y. C. Chan, D. Y. Luk:
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly I. Different bonding temperature.
1185-1194
Electronic Edition (link) BibTeX
- Y. C. Chan, D. Y. Luk:
Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure.
1195-1204
Electronic Edition (link) BibTeX
- Hua Lu, K. C. Hung, S. Stoyanov, C. Bailey, Y. C. Chan:
No-flow underfill flip chip assembly--an experimental and modeling analysis.
1205-1212
Electronic Edition (link) BibTeX
- P. Bojta, P. Németh, G. Harsányi:
Searching for appropriate humidity accelerated migration reliability tests methods.
1213-1218
Electronic Edition (link) BibTeX
- Huimin Xie, Anand Asundi, Chai Gin Boay, Lu Yunguang, Jin Yu, Zhaowei Zhong, Bryan K. A. Ngoi:
High resolution AFM scanning Moiré method and its application to the micro-deformation in the BGA electronic package.
1219-1227
Electronic Edition (link) BibTeX
- Wei Huang, James M. Loman, Bülent Sener:
Study of the effect of reflow time and temperature on Cu-Sn intermetallic compound layer reliability.
1229-1234
Electronic Edition (link) BibTeX
- Jann-Pygn Chen, W. L. Pearn:
Testing process performance based on the yield: an application to the liquid-crystal display module.
1235-1241
Electronic Edition (link) BibTeX
- M. Dhifi:
A novel simulation technique for testing analog ICs.
1243-1248
Electronic Edition (link) BibTeX
Volume 42,
Numbers 9-11,
September - November 2002
- Fausto Fantini, Massimo Vanzi:
Editorial.
1249
Electronic Edition (link) BibTeX
- H. Iwai, S. Ohmi:
Trend of CMOS downsizing and its reliability.
1251-1258
Electronic Edition (link) BibTeX
- Michael G. Pecht, Diganta Das, Arun Ramakrishnan:
The IEEE standards on reliability program and reliability prediction methods for electronic equipment.
1259-1266
Electronic Edition (link) BibTeX
- Wolfgang Stadler, K. Esmark, Harald Gossner, M. Streibl, M. Wendel, Wolfgang Fichtner, Dionyz Pogany, Martin Litzenberger, E. Gornik:
Device Simulation and Backside Laser Interferometry--Powerful Tools for ESD Protection Development.
1267-1274
Electronic Edition (link) BibTeX
- F. Zängl, Harald Gossner, K. Esmark, R. Owen, G. Zimmermann:
Case study of a technology transfer causing ESD problems.
1275-1280
Electronic Edition (link) BibTeX
- M. Blaho, Dionyz Pogany, L. Zullino, A. Andreini, E. Gornik:
Experimental and simulation analysis of a BCD ESD protection element under the DC and TLP stress conditions.
1281-1286
Electronic Edition (link) BibTeX
- M. S. B. Sowariraj, Theo Smedes, Cora Salm, Ton J. Mouthaan, Fred G. Kuper:
The influence of technology variation on ggNMOSTs and SCRs against CDM BSD stress.
1287-1292
Electronic Edition (link) BibTeX
- Gaudenzio Meneghesso, A. Cocco, G. Mura, Simona Podda, Massimo Vanzi:
Backside Failure Analysis of GaAs ICs after ESD tests.
1293-1298
Electronic Edition (link) BibTeX
- P. Galy, V. Berland, B. Foucher, A. Guilhaume, J. P. Chante, S. Bardy, F. Blanc:
Experimental and 3D simulation correlation of a gg-nMOS transistor under high current pulse.
1299-1302
Electronic Edition (link) BibTeX
- L. Sponton, L. Cerati, G. Croce, G. Mura, Simona Podda, Massimo Vanzi, Gaudenzio Meneghesso, Enrico Zanoni:
ESD protection structures for 20 V and 40 V power supply suitable for BCD6 smart power technology.
1303-1306
Electronic Edition (link) BibTeX
- J. L. Goudard, P. Berthier, X. Boddaert, D. Laffitte, J. Périnet:
New qualification approach for optoelectronic components.
1307-1310
Electronic Edition (link) BibTeX
- M. Giglio, G. Martines, G. Mura, Simona Podda, Massimo Vanzi:
An automated lifetest equipment for optical emitters.
1311-1315
Electronic Edition (link) BibTeX
- Massimo Vanzi, G. Salmini, R. Pastorelli, S. Pessina, P. Furcas:
Reliability tests on WDM filters.
1317-1321
Electronic Edition (link) BibTeX
- François Caloz, Daniel Ernst, Patrick Rossini, Laura Gherardi, Lisa Grassi, Jean Arnaud:
Reliability of optical connectors - Humidity behavior of the adhesive.
1323-1328
Electronic Edition (link) BibTeX
- Klaus Duerr, Reinhard Pusch, Gottfried Schmitt:
Reliability Problems of Passive Optical Devices and Modules after Mechanical, Thermal and Humidity Testing.
1329-1332
Electronic Edition (link) BibTeX
- T. Tomasi, I. De Munari, V. Lista, L. Gherardi, A. Righetti, M. Villa:
Passive optical components: from degradation data to reliability assessment - preliminary results.
1333-1338
Electronic Edition (link) BibTeX
- L. Tielemans, R. Rongen, Ward De Ceuninck:
How reliable are reliability tests?
1339-1345
Electronic Edition (link) BibTeX
- G. Scandurra, C. Ciofi, C. Pace, F. Speroni, F. Alagi:
True constant temperature MTF test system for the characterization of electromigration of thick Cu interconnection lines.
1347-1351
Electronic Edition (link) BibTeX
- B. Mongellaz, F. Marc, N. Milet-Lewis, Y. Danto:
Contribution to ageing simulation of complex analogue circuit using VHDL-AMS behavioural modelling language.
1353-1358
Electronic Edition (link) BibTeX
- R. Petersen, Ward De Ceuninck, Jan D'Haen, Marc D'Olieslaeger, Luc De Schepper, O. Vendier, H. Blanck, D. Pons:
Exploring the limits of Arrhenius-based life testing with heterojunction bipolar transistor technology.
1359-1363
Electronic Edition (link) BibTeX
- A. Mervic, A. Lanzani, M. Menchise, P. Serra, D. Gerosa:
Contact resistivity instability in embedded SRAM memory.
1365-1368
Electronic Edition (link) BibTeX
- E. Carvou, F. Le Bihan, A. C. Salaün, R. Rogel, Olivier Bonnaud, Yannick Rey-Tauriac, Xavier Gagnard, L. Roland:
Reliability improvement of high value doped polysilicon-based resistors.
1369-1372
Electronic Edition (link) BibTeX
- M. Mugnaini, M. Catelani, G. Ceschini, A. Masi, F. Nocentini:
Pseudo Time-Variant parameters in centrifugal compressor availability studies by means of Markov models.
1373-1376
Electronic Edition (link) BibTeX
- G. Ceschini, M. Mugnaini, A. Masi:
A reliability study for a submarine compression application.
1377-1380
Electronic Edition (link) BibTeX
- M. Catelani, R. Nicoletti:
A Custom-designed automatic measurement system for acquisition and management of reliability data.
1381-1384
Electronic Edition (link) BibTeX
- Yong-Ha Song, Myoung-Lae Park, Gye-Won Jung, Taek-Soo Kim:
A study of advanced layout verification to prevent leakage current failure during power down mode operation.
1385-1388
Electronic Edition (link) BibTeX
- V. Lista, P. Garbossa, T. Tomasi, M. Borgarino, Fausto Fantini, L. Gherardi, A. Righetti, M. Villa:
Degradation Based Long-Term Reliability Assessment for Electronic Components in Submarine Applications.
1389-1392
Electronic Edition (link) BibTeX
- P. Battista, M. Catelani, G. Fasano, A. Materassi:
On the reliability of instruments for environmental monitoring: some practical considerations.
1393-1396
Electronic Edition (link) BibTeX
- D. M. Fleetwood:
Hydrogen-related reliability issues for advanced microelectronics.
1397-1403
Electronic Edition (link) BibTeX
- B. Cretu, F. Balestra, G. Ghibaudo, G. Guégan:
Origin of hot carrier degradation in advanced nMOSFET devices.
1405-1408
Electronic Edition (link) BibTeX
- E. Andries, R. Dreesen, K. Croes, Ward De Ceuninck, Luc De Schepper, Guido Groeseneken, K. F. Lo, Marc D'Olieslaeger, Jan D'Haen:
Statistical aspects of the degradation of LDD nMOSFETs.
1409-1413
Electronic Edition (link) BibTeX
- H. V. Nguyen, Cora Salm, J. Vroemen, J. Voets, B. Krabbenborg, J. Bisschop, A. J. Mouthaan, Fred G. Kuper:
Fast temperature cycling and electromigration induced thin film cracking in multilevel interconnection: experiments and modeling.
1415-1420
Electronic Edition (link) BibTeX
- H. V. Nguyen, Cora Salm, R. Wenzel, A. J. Mouthaan, Fred G. Kuper:
Simulation and experimental characterization of reservoir and via layout effects on electromigration lifetime.
1421-1425
Electronic Edition (link) BibTeX
- Ruggero Feruglio, Fernanda Irrera, Bruno Riccò:
Microscopic aspects of defect generation in SiO2.
1427-1432
Electronic Edition (link) BibTeX
- Mahesh S. Krishnan, Viktor Kol'dyaev, Eiji Morifoji, Koji Miyamoto, Tomasz Brozek, Xiaolei Li:
Series resistance degradation due to NBTI in PMOSFET.
1433-1438
Electronic Edition (link) BibTeX
- S. Gamerith, M. Pölzl:
Negative bias temperature stress on low voltage p-channel DMOS transistors and the role of nitrogen.
1439-1443
Electronic Edition (link) BibTeX
- R. Rodríguez, James H. Stathis, Barry P. Linder, S. Kowalczyk, Ching-Te Chuang, Rajiv V. Joshi, Gregory A. Northrop, Kerry Bernstein, A. J. Bhavnagarwala, Salvatore Lombardo:
Analysis of the effect of the gate oxide breakdown on SRAM stability.
1445-1448
Electronic Edition (link) BibTeX
- B. Domengès, P. Schwindenhammer, P. Poirier, Felix Beaudoin, Ph. Descamps:
Comprehensive failure analysis of leakage faults in bipolar transistors.
1449-1452
Electronic Edition (link) BibTeX
- A. Muehlhoff:
Inversion of degradation direction of n-channel MOS-FETs in off-state operation.
1453-1456
Electronic Edition (link) BibTeX
- Hajdin Ceric, Siegfried Selberherr:
Simulative prediction of the resistance change due to electromigration induced void evolution.
1457-1460
Electronic Edition (link) BibTeX
- A. N. Nazarov, I. N. Osiyuk, V. S. Lysenko, T. Gebel, L. Rebohle, W. Skorupa:
Charge trapping and degradation in Ge+ ion implanted SiO2 layers during high-field electron injection.
1461-1464
Electronic Edition (link) BibTeX
- Ninoslav Stojadinovic, I. Manic, S. Djoric-Veljkovic, V. Davidovic, D. Dankovic, S. Golubovic, S. Dimitrijev:
Mechanisms of spontaneous recovery in positive gate bias stressed power VDMOSFETs.
1465-1468
Electronic Edition (link) BibTeX
- M. R. Carriero, S. Di Pascoli, Giuseppe Iannaccone:
Simulation of failure time distributions of metal lines under electromigration.
1469-1472
Electronic Edition (link) BibTeX
- G. Ghidini, D. Brazzelli:
Evaluation methodology of thin dielectrics for non-volatile memory application.
1473-1480
Electronic Edition (link) BibTeX
- Salvatore Lombardo, James H. Stathis, Barry P. Linder:
Dependence of Post-Breakdown Conduction on Gate Oxide Thickness.
1481-1484
Electronic Edition (link) BibTeX
- S. Aresu, Ward De Ceuninck, R. Dreesen, K. Croes, E. Andries, J. Manca, Luc De Schepper, Robin Degraeve, Ben Kaczer, Marc D'Olieslaeger:
High-resolution SILC measurements of thin SiO2 at ultra low voltages.
1485-1489
Electronic Edition (link) BibTeX
- E. Viganò, A. Ghetti, G. Ghidini, A. S. Spinelli:
Post-breakdown characterization in thin gate oxides.
1491-1496
Electronic Edition (link) BibTeX
- D. Roy, S. Bruyère, E. Vincent, F. Monsieur:
Series resistance and oxide thickness spread influence on Weibull breakdown distribution: New experimental correction for reliability projection improvement.
1497-1500
Electronic Edition (link) BibTeX
- J. M. Rafí, B. Vergnet, F. Campabadal, C. Fleta, L. Fonseca, M. Lozano, C. Martínez, M. Ullán:
Electrical characteristics of high-energy proton irradiated ultra-thin gate oxides.
1501-1504
Electronic Edition (link) BibTeX
- F. Monsieur, E. Vincent, D. Roy, S. Bruyère, G. Pananakakis, G. Ghibaudo:
Gate oxide Reliability assessment optimization.
1505-1508
Electronic Edition (link) BibTeX
- P. Caprara, A. Barcella, M. Beltramello, C. Brambilla, S. Cereda, C. Caimi, V. Contin, V. Daniele, M. Fontana, P. Lucarno:
Analyses on NVM Circuitry Delay Induced by Source & Drain BF2 Implant.
1509-1511
Electronic Edition (link) BibTeX
- X. Blasco, M. Nafría, X. Aymerich:
Conduction and Breakdown Behaviour of Atomic Force Microscopy Grown SiO2 Gate Oxide on MOS Structures.
1513-1516
Electronic Edition (link) BibTeX
- J. Augereau, Y. Ousten, L. Béchou, Y. Danto:
Acoustic analysis of an assembly: Structural identification by signal processing (wavelets).
1517-1522
Electronic Edition (link) BibTeX
- C. Passagrilli, L. Gobbato, R. Tiziani:
Reliability of Au/Al bonding in plastic packages for high temperature (200degreeC) and high current applications.
1523-1528
Electronic Edition (link) BibTeX
- P. Guilbault, E. Woirgard, C. Zardini, D. Lambert:
Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations.
1529-1533
Electronic Edition (link) BibTeX
- Mohandass Sivakumar, Vaidyanathan Kripesh, Chong Ser Choong, Chai Tai Chong, Loon Aik Lim:
Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly.
1535-1540
Electronic Edition (link) BibTeX
- Giulio Di Giacomo, Stefano Oggioni:
Reliability of Flip Chip Applications with Ceramic and Organic Chip Carriers.
1541-1546
Electronic Edition (link) BibTeX
- A. Seppälä, T. Allinniemi, Eero Ristolainen:
Failure mechanisms of adhesive flip chip joints.
1547-1550
Electronic Edition (link) BibTeX
- G. Duchamp, Y. Ousten, Y. Danto:
Evaluation of a micropackaging analysis technique by highfrequency microwaves.
1551-1554
Electronic Edition (link) BibTeX
- Alexandrine Guédon, Eric Woirgard, Christian Zardini:
Evaluation of lead-free soldering for automotive applications.
1555-1558
Electronic Edition (link) BibTeX
- L. Frisk, J. Järvinen, R. Ristolainen:
Chip on flex attachment with thermoplastic ACF for RFID applications.
1559-1562
Electronic Edition (link) BibTeX
- Cezary Sydlo, M. Saglam, Bastian Mottet, M. Rodríguez-Gironés, Hans L. Hartnagel:
Reliability investigations on HBV using pulsed electrical stress.
1563-1568
Electronic Edition (link) BibTeX
- M. Dammann, F. Benkhelifa, M. Meng, W. Jantz:
Reliability of Metamorphic HEMTs for Power Applications.
1569-1573
Electronic Edition (link) BibTeX
- N. Labat, N. Malbert, B. Lambert, A. Touboul, F. Garat, B. Proust:
Degradation mechanisms induced by thermal and bias stresses in InP HEMTs.
1575-1580
Electronic Edition (link) BibTeX
- Felix Beaudoin, D. Carisetti, Romain Desplats, Philippe Perdu, D. Lewis, J. C. Clement:
Backside Defect Localizations and Revelations Techniques on Gallium Arsenide (GaAs) Devices.
1581-1585
Electronic Edition (link) BibTeX
- P. Cova, Roberto Menozzi, M. Dammann, T. Feltgen, W. Jantz:
High-field step-stress and long term stability of PHEMTs with different gate and recess lengths.
1587-1592
Electronic Edition (link) BibTeX
- V. Ichizli, M. Rodríguez-Gironés, L. Marchand, C. Garden, O. Cojocari, Bastian Mottet, Hans L. Hartnagel:
Process Control and Failure Analysis Implementation for THz Schottky-based components.
1593-1596
Electronic Edition (link) BibTeX
- N. Seliger, E. Wolfgang, G. Lefranc, H. Berg, T. Licht:
Reliable power electronics for automotive applications.
1597-1604
Electronic Edition (link) BibTeX
- Alberto Castellazzi, R. Kraus, N. Seliger, Doris Schmitt-Landsiedel:
Reliability analysis of power MOSFET's with the help of compact models and circuit simulation.
1605-1610
Electronic Edition (link) BibTeX
- R. Tiziani, G. Passoni, G. Santospirito:
Adhesive die attach for power application: Performance and reliability in plastic package.
1611-1616
Electronic Edition (link) BibTeX
- Sebastiano Russo, Romeo Letor, Orazio Viscuso, Lucia Torrisi, Gianluigi Vitali:
Fast thermal fatigue on top metal layer of power devices.
1617-1622
Electronic Edition (link) BibTeX
- Sudha Gopalan, Benno H. Krabbenborg, Jan-Hein Egbers, Bart van Velzen, Rene Zingg:
Reliability of power transistors against application driven temperature swings.
1623-1628
Electronic Edition (link) BibTeX
- F. Velardi, F. Iannuzzo, G. Busatto, J. Wyss, A. Kaminksy:
The Reliability of New Generation Power MOSFETs in Radiation Environment.
1629-1634
Electronic Edition (link) BibTeX
- G. Busatto, B. Cascone, L. Fratelli, M. Balsamo, F. Iannuzzo, F. Velardi:
Non-destructive high temperature characterisation of high-voltage IGBTs.
1635-1640
Electronic Edition (link) BibTeX
- G. Lefranc, T. Licht, G. Mitic:
Properties of solders and their fatigue in power modules.
1641-1646
Electronic Edition (link) BibTeX
- Masanori Usui, Takahide Sugiyama, Masayasu Ishiko, Jun Morimoto, Hirokazu Saitoh, Masaki Ajioka:
Characterization of Trench MOS Gate Structures Utilizing Photon Emission Microscopy.
1647-1652
Electronic Edition (link) BibTeX
- Mauro Ciappa, Flavio Carbognani, P. Cova, Wolfgang Fichtner:
A Novel Thermomechanics -Based Lifetime Prediction Model for Cycle Fatigue Failure Mechanisms in Power Semiconductors.
1653-1658
Electronic Edition (link) BibTeX
- G. Curro, R. Greco, A. Scandurra:
Growth process and chemical characterization of an ultrathin phosphate film grafted onto Al-alloy metallization surfaces relevant to microelectronic devices reliability.
1659-1662
Electronic Edition (link) BibTeX
- S. Moreau, S. Forster, T. Lequeu, R. Jérisian:
Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2.
1663-1666
Electronic Edition (link) BibTeX
- Chun-Cheng Tsao, Bill Thompson, Ted Lundquist:
Imaging and Material Analysis from Sputter-Induced Light Emission Using Coaxial Ion-Photon Column.
1667-1672
Electronic Edition (link) BibTeX
- Dionyz Pogany, J. Kuzmik, J. Darmo, Martin Litzenberger, Scrgey Bychikhin, K. Unterrainer, Z. Mozolova, S. Hascik, Tibor Lalinsky, E. Gornik:
Electrical field mapping in InGaP HEMTs and GaAs terahertz emitters using backside infrared OBIC technique.
1673-1677
Electronic Edition (link) BibTeX
- Katsuyoshi Miura, Koji Nakamae, Hiromu Fujioka:
CAD navigation system, for backside waveform probing of CMOS devices.
1679-1684
Electronic Edition (link) BibTeX
- A.-D. Müller, F. Müller, J. Middeke, J. Mehner, J. Wibbeler, Th. Gessner, M. Hietschold:
Double-cantilever device for Atomic Force Microscopy in dynamic noncontact-mode.
1685-1688
Electronic Edition (link) BibTeX
- Franco Stellari, Peilin Song, James C. Tsang, Moyra K. McManus, Mark B. Ketchen:
Optical diagnosis of excess IDDQ in low power CMOS circuits.
1689-1694
Electronic Edition (link) BibTeX
- M. Neinhüs, R. Weber, Ulf Behnke, W. Merlin, E. Kubalek, R. A. Breil, M. Detje, A. Feltz:
Contactless current and voltage measurements in integrated circuits by using a needle sensor.
1695-1700
Electronic Edition (link) BibTeX
- Maria Stangoni, Mauro Ciappa, Marco Buzzo, M. Leicht, Wolfgang Fichtner:
Simulation and Experimental Validation of Scanning Capacitance Microscopy Measurements across Low-doped Epitaxial PN-Junction.
1701-1706
Electronic Edition (link) BibTeX
- Jon C. Lee, C. H. Chen, David Su, J. H. Chuang:
Investigation of Sensitivity Improvement on Passive Voltage Contrast for Defect Isolation.
1707-1710
Electronic Edition (link) BibTeX
- T. H. Lee, X. Guo, G. D. Shen, Y. Ji, G. H. Wang, J. Y. Du, X. Z. Wang, G. Gao, A. Altes, L. J. Balk:
Investigation of Tunnel-Regenerated Multi-Active-Region Light-Emitting Diodes (TRMAR LED) by Scanning Thermal Microscopy (STHM).
1711-1714
Electronic Edition (link) BibTeX
- C. Caprile, I. De Munari, M. Improntac, Simona Podda, A. Scorzoni, Massimo Vanzi:
A specimen-current branching approach for FA of long Electromigration test lines.
1715-1718
Electronic Edition (link) BibTeX
- R. F. Szeloch, T. P. Gotszalk, P. Janus:
Scanning Thermal Microscopy in Microsystem Reliability Analysis.
1719-1722
Electronic Edition (link) BibTeX
- C. Giret, D. Bru, D. Faure, C. Ali, M. Razani, D. Gobled:
Electrical characteristics measurement of transistors by 4 tips-0.2 micron probing technique in Semiconductor Failure Analysis.
1723-1727
Electronic Edition (link) BibTeX
- Felix Beaudoin, G. Haller, Philippe Perdu, Romain Desplats, T. Beauchêne, D. Lewis:
Reliability Defect Monitoring with Thermal Laser Stimulation: Biased Versus Unbiased.
1729-1734
Electronic Edition (link) BibTeX
- Janet E. Semmens, Lawrence W. Kessler:
Application of Acoustic Frequency Domain Imaging for the Evaluation of Advanced Micro Electronic Packages.
1735-1740
Electronic Edition (link) BibTeX
- O. Crépel, Felix Beaudoin, L. Dantas de Morais, G. Haller, C. Goupil, Philippe Perdu, Romain Desplats, D. Lewis:
Backside Hot Spot Detection Using Liquid Crystal Microscopy.
1741-1746
Electronic Edition (link) BibTeX
- N. Bicaïs-Lépinay, F. André, R. Pantel, S. Jullian, A. Margain, L. F. Tz. Kwakman:
Lift-out techniques coupled with advanced TEM characterization methods for electrical failure analysis.
1747-1752
Electronic Edition (link) BibTeX
- Joachim C. Reiner, Philippe Gasser, Urs Sennhauser:
Novel FIB-based sample preparation technique for TEM analysis of ultra-thin gate oxide breakdown.
1753-1757
Electronic Edition (link) BibTeX
- C. Hartmann, R. Weber, W. Mertin, E. Kubalek, A.-D. Müller, M. Hietschold:
Simultaneous IC-internal voltage and current measurements via a multi lever Scanning Force Microscope.
1759-1762
Electronic Edition (link) BibTeX
- O. Crépel, C. Goupil, B. Domengès, Ph. Descamps, Philippe Perdu, A. Doukkali:
Magnetic field measurements for Non Destructive Failure Analysis.
1763-1766
Electronic Edition (link) BibTeX
- D. Faure, C. A. Waggoner:
A New sub-micro probing technique for failure analysis in integrated circuits.
1767-1770
Electronic Edition (link) BibTeX
Volume 42,
Number 12,
December 2002
- Anri Nakajima, Quazi D. M. Khosru, Takashi Yoshimoto, Shin Yokoyama:
Atomic-layer-deposited silicon-nitride/SiO2 stack--a highly potential gate dielectrics for advanced CMOS technology.
1823-1835
Electronic Edition (link) BibTeX
- Deok-Hoon Kim, Peter Elenius, Michael Johnson, Scott Barrett:
Solder joint reliability of a polymer reinforced wafer level package.
1837-1848
Electronic Edition (link) BibTeX
- A. Zehe:
Prediction of electromigration-void formation in copper conductors based on the electron configuration of matrix and solute atoms.
1849-1855
Electronic Edition (link) BibTeX
- K. Y. Lim, X. Zhou:
An analytical effective channel-length modulation model for velocity overshoot in submicron MOSFETs based on energy-balance formulation.
1857-1864
Electronic Edition (link) BibTeX
- Boualem Djezzar:
On the correlation between radiation-induced oxide- and border-trap effects in the gate-oxide nMOSFET's.
1865-1874
Electronic Edition (link) BibTeX
- Dimitrios N. Kouvatsos:
On-state and off-state stress-induced degradation in unhydrogenated solid phase crystallized polysilicon thin film transistors.
1875-1882
Electronic Edition (link) BibTeX
- Xingsheng Liu, Shuangyan Xu, Guo-Quan Lu, David A. Dillard:
Effect of substrate flexibility on solder joint reliability.
1883-1891
Electronic Edition (link) BibTeX
- De-Shin Liu, Chin-Yu Ni:
The optimization design of bump interconnections in flip chip packages from the electrical standpoint.
1893-1901
Electronic Edition (link) BibTeX
- Chin-Yu Ni, De-Shin Liu, Ching-Yang Chen:
Procedure for design optimization of a T-cap flip chip package.
1903-1911
Electronic Edition (link) BibTeX
- Erja Jokinen, Eero Ristolainen:
Anisotropic conductive film flip chip joining using thin chips.
1913-1920
Electronic Edition (link) BibTeX
- Frank Stepniak:
Failure criteria of flip chip joints during accelerated testing.
1921-1930
Electronic Edition (link) BibTeX
- Dongji Xie, Sammy Yi:
Reliability studies and design improvement of mirror image CSP assembly.
1931-1937
Electronic Edition (link) BibTeX
- Silke Liebert:
Encapsulation of naked dies for bulk silicon etching with TMAH.
1939-1944
Electronic Edition (link) BibTeX
- Y. W. Chiu, Y. C. Chan, S. M. Lui:
Study of short-circuiting between adjacent joints under electric field effects in fine pitch anisotropic conductive adhesive interconnects.
1945-1951
Electronic Edition (link) BibTeX
- Sunit Rane, Vijaya Puri:
Thin film, thick film microstrip band pass filter: a comparison and effect of bulk overlay.
1953-1958
Electronic Edition (link) BibTeX
- Predrag Osmokrovic, Boris Loncar, Srboljub Stankovic, Aleksandra Vasic:
Aging of the over-voltage protection elements caused by over-voltages.
1959-1966
Electronic Edition (link) BibTeX
- E. M. Baskin:
Analysis of burn-in time using the general law of reliability.
1967-1974
Electronic Edition (link) BibTeX
- P. C. Lin, W. L. Pearn:
Testing process capability for one-sided specification limit with application to the voltage level translator.
1975-1983
Electronic Edition (link) BibTeX
- B. L. Yang, N. W. Cheung, S. Denholm, J. Shao, H. Wong, P. T. Lai, Y. C. Cheng:
Ultra-shallow n+p junction formed by PH3 and AsH3 plasma immersion ion implantation.
1985-1989
Electronic Edition (link) BibTeX
- Shoucai Yuan, Changchun Zhu:
An IGBT DC subcircuit model with non-destructive parameters extraction and comparison with measurements.
1991-1996
Electronic Edition (link) BibTeX
- Zhigang Song, Jiyan Dai, Shailesh Redkar:
Open contact analysis of single bit failure in 0.18 mum technology.
1997-2001
Electronic Edition (link) BibTeX
- V. O. Balitska, B. Butkievich, O. I. Shpotyuk, M. M. Vakiv:
On the analytical description of ageing kinetics in ceramic manganite-based NTC thermistors.
2003-2007
Electronic Edition (link) BibTeX
- M. L. Huang, K. S. Chen, Y. H. Hung:
Integrated process capability analysis with an application in backlight module.
2009-2014
Electronic Edition (link) BibTeX
Copyright © Sun May 17 00:14:10 2009
by Michael Ley (ley@uni-trier.de)
