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Scott Barrett

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2002
1EEDeok-Hoon Kim, Peter Elenius, Michael Johnson, Scott Barrett: Solder joint reliability of a polymer reinforced wafer level package. Microelectronics Reliability 42(12): 1837-1848 (2002)

Coauthor Index

1Peter Elenius [1]
2Michael Johnson [1]
3Deok-Hoon Kim [1]

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